205 продукты
ОБРАЗ ЧАСТЬ №. ЦЕНА КОЛИЧЕСТВО АКЦИИ ПРОИЗВОДСТВО ОПИСАНИЕ Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
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За единицу
$24.93
RFQ
3,094
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD 6556 Active Bulk Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
За единицу
$24.66
RFQ
3,252
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
За единицу
$118.93
RFQ
633
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Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
За единицу
$118.93
RFQ
1,416
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
За единицу
$36.70
RFQ
1,964
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 48POS GOLD 6556 Active Bulk Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
За единицу
$35.75
RFQ
1,057
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 40POS GOLD 6556 Active Bulk Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
За единицу
$35.73
RFQ
2,947
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
За единицу
$35.53
RFQ
2,127
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
За единицу
$35.53
RFQ
3,685
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
За единицу
$35.53
RFQ
3,768
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
За единицу
$35.53
RFQ
3,805
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
За единицу
$30.52
RFQ
3,308
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 36POS GOLD 6556 Active Bulk Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
За единицу
$40.18
RFQ
1,937
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 48POS GOLD 6556 Active Bulk Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
За единицу
$38.88
RFQ
3,319
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
За единицу
$32.74
RFQ
3,755
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 40POS GOLD 6556 Active Bulk Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
За единицу
$20.12
RFQ
1,211
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
За единицу
$20.12
RFQ
632
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
За единицу
$37.08
RFQ
3,239
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 42POS GOLD 6556 Active Bulk Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
За единицу
$18.15
RFQ
1,101
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
За единицу
$18.15
RFQ
3,597
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
За единицу
$18.15
RFQ
1,254
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
За единицу
$18.15
RFQ
2,683
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
За единицу
$18.15
RFQ
1,460
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
За единицу
$32.48
RFQ
1,518
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 36POS GOLD 6556 Active Bulk Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
За единицу
$17.99
RFQ
1,748
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
За единицу
$32.23
RFQ
1,662
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET ZIF 40POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
За единицу
$32.23
RFQ
1,876
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET ZIF 40POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
За единицу
$16.29
RFQ
3,977
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
За единицу
$16.29
RFQ
3,565
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
За единицу
$16.19
RFQ
656
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper