- Housing Material :
3 продукты
ОБРАЗ | ЧАСТЬ №. | ЦЕНА | КОЛИЧЕСТВО | АКЦИИ | ПРОИЗВОДСТВО | ОПИСАНИЕ | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | |
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1,115
Сегодня корабль + бесплатная ночная доставка
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 18 (2 x 9) | Beryllium Copper | Beryllium Copper | ||||
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719
Сегодня корабль + бесплатная ночная доставка
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 18 (2 x 9) | Beryllium Copper | Nickel | ||||
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1,927
Сегодня корабль + бесплатная ночная доставка
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 500 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Tin-Lead | 18 (2 x 9) | Beryllium Copper | Beryllium Copper |
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