8 продукты
ОБРАЗ ЧАСТЬ №. ЦЕНА КОЛИЧЕСТВО АКЦИИ ПРОИЗВОДСТВО ОПИСАНИЕ Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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За единицу
$6.41
RFQ
1,862
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
За единицу
$6.41
RFQ
2,571
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
За единицу
$8.69
RFQ
1,109
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
За единицу
$8.69
RFQ
2,467
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
За единицу
$8.69
RFQ
3,721
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 16POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
За единицу
$8.65
RFQ
1,352
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 22POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
10-4823-90C
За единицу
$6.97
RFQ
1,904
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 10POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
За единицу
$5.46
RFQ
748
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 10POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass