38 продукты
| ОБРАЗ | ЧАСТЬ №. | ЦЕНА | КОЛИЧЕСТВО | АКЦИИ | ПРОИЗВОДСТВО | ОПИСАНИЕ | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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2,234
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,195
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,822
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,755
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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1,014
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,008
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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1,483
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,034
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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2,110
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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1,555
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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1,755
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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2,827
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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1,143
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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2,439
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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1,098
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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1,890
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,826
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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1,782
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,006
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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1,247
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,639
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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2,788
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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814
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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1,295
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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2,948
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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1,476
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,964
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,319
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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1,904
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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1,508
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass |
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