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ОБРАЗ ЧАСТЬ №. ЦЕНА КОЛИЧЕСТВО АКЦИИ ПРОИЗВОДСТВО ОПИСАНИЕ Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
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ПОЛУЧИТЬ ЦИТАТЫ
RFQ
856
Сегодня корабль + бесплатная ночная доставка
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole, Right Angle, Vertical Solder Carrier, Closed Frame DIP, 0.3" (7.62mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) 18 (2 x 9) Beryllium Copper Beryllium Copper
714-43-218-31-018000
За единицу
$5.10
RFQ
1,914
Сегодня корабль + бесплатная ночная доставка
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper Brass Alloy