Number of Positions or Pins (Grid) :
2 продукты
ОБРАЗ ЧАСТЬ №. ЦЕНА КОЛИЧЕСТВО АКЦИИ ПРОИЗВОДСТВО ОПИСАНИЕ Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
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$2.44
RFQ
2,188
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 16POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash 16 (2 x 8) Beryllium Copper
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За единицу
$3.81
RFQ
2,636
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash 20 (2 x 10) Beryllium Copper