3 продукты
ОБРАЗ ЧАСТЬ №. ЦЕНА КОЛИЧЕСТВО АКЦИИ ПРОИЗВОДСТВО ОПИСАНИЕ Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
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За единицу
$1.59
RFQ
2,631
Сегодня корабль + бесплатная ночная доставка
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 14POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper
XR2A-1401-N
За единицу
$2.08
RFQ
862
Сегодня корабль + бесплатная ночная доставка
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 14POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 14 (2 x 7) Beryllium Copper
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За единицу
$2.13
RFQ
1,085
Сегодня корабль + бесплатная ночная доставка
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 14POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash 14 (2 x 7) Beryllium Copper