- Operating Temperature :
- Mounting Type :
- Termination :
16 продукты
| ОБРАЗ | ЧАСТЬ №. | ЦЕНА | КОЛИЧЕСТВО | АКЦИИ | ПРОИЗВОДСТВО | ОПИСАНИЕ | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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797
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,240
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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2,752
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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2,584
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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2,368
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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3,681
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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3,710
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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3,757
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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3,274
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,088
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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720
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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3,214
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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2,169
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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1,681
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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2,851
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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3,973
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass |
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