6 продукты
ОБРАЗ ЧАСТЬ №. ЦЕНА КОЛИЧЕСТВО АКЦИИ ПРОИЗВОДСТВО ОПИСАНИЕ Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
За единицу
$7.99
RFQ
865
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 18POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
За единицу
$7.99
RFQ
3,191
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 18POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
За единицу
$7.99
RFQ
1,149
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 18POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
18-6823-90C
За единицу
$8.58
RFQ
2,299
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 18POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
За единицу
$8.58
RFQ
3,981
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 18POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
За единицу
$8.58
RFQ
2,638
Сегодня корабль + бесплатная ночная доставка
Aries Electronics CONN IC DIP SOCKET 18POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass