8 продукты
| ОБРАЗ | ЧАСТЬ №. | ЦЕНА | КОЛИЧЕСТВО | АКЦИИ | ПРОИЗВОДСТВО | ОПИСАНИЕ | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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1,804
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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1,551
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,521
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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1,782
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,616
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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921
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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2,280
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,996
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass |
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