- Series :
- Part Status :
- Operating Temperature :
- Termination :
- Housing Material :
-
- Polyamide (PA46), Nylon 4/6 (21)
- Polyamide (PA46), Nylon 4/6, Glass Filled (110)
- Polybutylene Terephthalate (PBT), Glass Filled (2)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (54)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (144)
- Polyphenylene Sulfide (PPS), Glass Filled (2)
- Thermoplastic (4)
- Thermoplastic, Polyester (4)
- Thermoplastic, Polyester, Glass Filled (1)
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Прикладные фильтры :
344 продукты
| ОБРАЗ | ЧАСТЬ №. | ЦЕНА | КОЛИЧЕСТВО | АКЦИИ | ПРОИЗВОДСТВО | ОПИСАНИЕ | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
ПОЛУЧИТЬ ЦИТАТЫ |
3,976
Сегодня корабль + бесплатная ночная доставка
|
3M | CONN IC DIP SOCKET 10POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 10 (2 x 5) | Beryllium Copper | Flash | Brass | ||
|
|
ПОЛУЧИТЬ ЦИТАТЫ |
3,805
Сегодня корабль + бесплатная ночная доставка
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 10POS TIN | 510 | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 10 (2 x 5) | Beryllium Copper | 20.0µin (0.51µm) | Copper | ||
|
|
|
ПОЛУЧИТЬ ЦИТАТЫ |
2,327
Сегодня корабль + бесплатная ночная доставка
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 10POS GOLD | - | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | Flash | Gold | 10 (2 x 5) | Beryllium Copper | Flash | Brass | ||
|
|
|
ПОЛУЧИТЬ ЦИТАТЫ |
2,989
Сегодня корабль + бесплатная ночная доставка
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 10POS TIN | - | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Tin | 10 (2 x 5) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||
|
|
|
ПОЛУЧИТЬ ЦИТАТЫ |
2,213
Сегодня корабль + бесплатная ночная доставка
|
3M | CONN IC DIP SOCKET 10POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 10 (2 x 5) | Beryllium Copper | Flash | Brass | ||
|
|
|
1,785
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
2,960
Сегодня корабль + бесплатная ночная доставка
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
|
1,975
Сегодня корабль + бесплатная ночная доставка
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
|
3,033
Сегодня корабль + бесплатная ночная доставка
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
|
706
Сегодня корабль + бесплатная ночная доставка
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
|
2,593
Сегодня корабль + бесплатная ночная доставка
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
|
667
Сегодня корабль + бесплатная ночная доставка
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
|
2,551
Сегодня корабль + бесплатная ночная доставка
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
|
1,424
Сегодня корабль + бесплатная ночная доставка
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS GOLD | 121 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
|
2,072
Сегодня корабль + бесплатная ночная доставка
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS GOLD | 114 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
|
1,655
Сегодня корабль + бесплатная ночная доставка
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS GOLD | 114 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
2,760
Сегодня корабль + бесплатная ночная доставка
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS TINLEAD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
2,714
Сегодня корабль + бесплатная ночная доставка
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS TINLEAD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Tin-Lead | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
|
1,194
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
|
2,396
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
|
666
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 10POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 10 (2 x 5) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
|
1,692
Сегодня корабль + бесплатная ночная доставка
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
|
915
Сегодня корабль + бесплатная ночная доставка
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
|
739
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
3,701
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
3,950
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
853
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
1,720
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
3,277
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
3,062
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass |
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