- Part Status :
- Operating Temperature :
- Termination :
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Прикладные фильтры :
70 продукты
| ОБРАЗ | ЧАСТЬ №. | ЦЕНА | КОЛИЧЕСТВО | АКЦИИ | ПРОИЗВОДСТВО | ОПИСАНИЕ | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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ПОЛУЧИТЬ ЦИТАТЫ |
3,215
Сегодня корабль + бесплатная ночная доставка
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 30POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 30 (2 x 15) | Beryllium Copper | - | Beryllium Copper | ||
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1,798
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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1,132
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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2,778
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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3,594
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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1,443
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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2,346
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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1,431
Сегодня корабль + бесплатная ночная доставка
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 30POS GOLD | 127 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 30 (2 x 15) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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1,153
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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3,823
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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958
Сегодня корабль + бесплатная ночная доставка
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 30POS GOLD | 127 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 30 (2 x 15) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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3,883
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,948
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,237
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 30POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (2 x 15) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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3,627
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,742
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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2,392
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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3,850
Сегодня корабль + бесплатная ночная доставка
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 30POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 30 (2 x 15) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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1,591
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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2,179
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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2,317
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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1,013
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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1,520
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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2,706
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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2,856
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 30POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (2 x 15) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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3,345
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 30 (2 x 15) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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1,284
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 30 (2 x 15) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
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2,020
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 30POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (2 x 15) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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2,614
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 30 (2 x 15) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
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3,461
Сегодня корабль + бесплатная ночная доставка
|
Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 30 (2 x 15) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze |
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