- Contact Material - Mating :
14 продукты
| ОБРАЗ | ЧАСТЬ №. | ЦЕНА | КОЛИЧЕСТВО | АКЦИИ | ПРОИЗВОДСТВО | ОПИСАНИЕ | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | |
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3,259
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Copper | |||
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3,354
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Copper | |||
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2,831
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Copper | |||
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3,847
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Copper | |||
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2,874
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Copper | |||
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1,109
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Copper | |||
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1,509
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Copper | |||
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3,534
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Nickel | |||
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3,188
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Nickel | |||
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2,121
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Nickel | |||
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922
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Nickel | |||
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3,320
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Nickel | |||
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2,535
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Nickel | |||
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906
Сегодня корабль + бесплатная ночная доставка
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 40 (2 x 20) | Beryllium Copper |
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