5 продукты
ОБРАЗ ЧАСТЬ №. ЦЕНА КОЛИЧЕСТВО АКЦИИ ПРОИЗВОДСТВО ОПИСАНИЕ Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post
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За единицу
$0.43
RFQ
656
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Assmann WSW Components CONN IC DIP SOCKET 10POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm)
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За единицу
$0.73
RFQ
671
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Assmann WSW Components CONN IC DIP SOCKET 28POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm)
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За единицу
$1.25
RFQ
3,355
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Assmann WSW Components CONN IC DIP SOCKET 32POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm)
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За единицу
$1.14
RFQ
2,345
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Assmann WSW Components CONN IC DIP SOCKET 4POS TIN - Active Bulk -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 4 (2 x 2) Beryllium Copper 200.0µin (5.08µm)
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За единицу
$1.06
RFQ
3,589
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Assmann WSW Components CONN IC DIP SOCKET 24POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm)